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ME 5353. COMPUTATIONAL TECHNIQUES FOR ELECTRONIC PACKAGING. 3 Hours.
Characterization of the thermo/mechanical reliability of microelectronics devices using commercial computational heat transfer codes (Icepack, Flotherm, and ANSYS). Industry related problems ranging from first level packages through system level packages analyzed. Formulate and model contemporary problems using commercial CFD codes.
Mechanical and Aerospace Engineering - Undergraduate Programs
http://catalog.uta.edu/engineering/mechanical/undergraduate/
...satisfy both ME bachelor's and ME master...POLYMER MATERIALS SCIENCE MSE 5353 FUNDAMENTALS OF SUSTAINABLE...