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MEĀ 5353. APPLICATION OF COMPUTATIONAL TECHNIQUES TO ELECTRONIC PACKAGING. 3 Hours.

This course will develop the student's capability to characterize the heat performance of electronic cooling devices by using "Commercial Computational Heat Transfer Codes (IDEAS ESC, Icepack, Flotherm, CFDAce, ...)." In addition, the use of MacroFlow, a network based model, for system-level thermal design for electronics cooling will be presented. A number of industry-related problems ranging from first-level packages through system-level packages would be analyzed. At the end of the class, a student is expected to formulate and model complex industry-based problems using the commercial CFD codes. There will be frequent industry speakers on specific projects being studied in the class.

Mechanical and Aerospace Engineering - Undergraduate Programs

http://catalog.uta.edu/engineering/mechanical/undergraduate/

...satisfy both ME bachelor's and ME master...POLYMER MATERIALS SCIENCE MSE 5353 FUNDAMENTALS OF SUSTAINABLE...